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| PD 6.116 IRPT1060A PRELIMINARY IRPT1060A TM Power Module for 1 hp Motor Drives * 1 hp (0.75kW) power output Industrial rating at 150% overload for 1 minute * * * * * * * * * 180-240V AC input, 50/60 Hz 3-phase rectifier bridge 3-phase, short circuit rated, ultrafast IGBT inverter HEXFRED ultrafast soft recovery freewheeling diodes Low inductance (current sense) shunts in positive and negative DC rail NTC temperature sensor Pin-to-baseplate isolation 2500V rms Easy-to-mount two-screw package Case temperature range -25C to 125C operational Figure 1. IRPT1060A Power Module IRPT1060C PWM variable frequency output 180-240V 3-phase input IRPT1060A Power Module IRPT1060D Driver-Plus Board feedback (non-isolated) PWM generator feedback processing keyboard Figure 2. The power module and motor control system within a page 1 IRPT1060A System Description The IRPT1060A Power Module The IRPT1060A Power Module, shown in figure 1, is a chip and wire epoxy encapsulated module. It houses input rectifiers, output inverter, current sense shunts and NTC thermistor. The 3-phase input bridge rectifiers are rated at 800V. The inverter section employs 600V, short circuit rated, ultrafast IGBTs and ultrafast freewheeling diodes. Current sensing is achieved through 45 m low inductance shunts provided in the positive and negative DC bus rail. The NTC thermistor provides temperature sensing capability. The lead spacing on the power module meets UL840 pollution level 3 requirements. The power circuit and layout within the module are carefully designed to minimize inductance in the power path, to reduce noise during inverter operation and to improve the inverter efficiency. The Driver-Plus Board required to run the inverter can be soldered to the power module pins, thus minimizing assembly and alignment. The power module is designed to be mounted to a heat sink with two screw mount positions, in order to insure good thermal contact between the module substrate and the heat sink. and Design Kit The IRPT1060C (Figure 3) provides the complete power conversion function for a 1 hp (0.75 kW) variable voltage, variable frequency AC motor controller. The combines the Power Module (IRPT1060A) with a Driver-Plus Board (IRPT1060D). The Design Kit, IRPT1060E includes the following: * Complete integrated power stage * Specification and operating instructions * Bill of materials * Electrical schematic * Mechanical layout for Driver-Plus Board * Software transferrable file for easy design integration * Application information and layout considerations Figure 3. IRPT1060C page 2 IRPT1060A Specifications PARAMETERS Input Power Voltage Frequency Current IFSM VALUES 220V AC, -15%, +10%, 3-phase 50/60 Hz 6.2A rms @ nominal output 150A 0 - 230V rms 1 hp (0.75 kW) nominal full load power 150% overload for 1 minute 4.4A nominal full load power 6.6A 150% overload for 1 minute 425V maximum 50 kOhms 5% 3.1kOhms 10% 45mOhms 5% 10s 30A peak CONDITIONS TA = 40C, R thSA = 1.38C/W 10ms half-cycle, non-repetitive surge defined by external PWM control V in = 220V, fpwm = 4 kHz, f o = 60 Hz, TA = 40C, RthSA = 1.38C/W Output Power Voltage Nominal motor hp (kW) Nominal motor current DC Link DC link voltage Sensor Temp. sense resistance Current sense @ TNTC = 25C @ TNTC = 100C @ TSHUNT = 25C DC bus = 425V, VGE = 15V, line to line short Protection IGBT short circuit time Recommended short circuitshutdown current Gate Drive QG 67 nC (typical) @ VGE = 15V, refer Figure 5b Recommended gate driver IR2132J (see Figure 10) 2500V rms -25C to 125C 1 Nm -40C to 125C 260C maximum refer design kit IRPT1060E pin-to-baseplate, 60 Hz, 1 minute 95% RH max. (non-condensing) M4 screw type at the pins (.06" from case) Module Isolation voltage Operating case temperature Mounting torque Storage temperature range Soldering temperature for 10 sec. page 3 IRPT1060A 2 1.8 90 80 70 Thermal Resistance (RthSAC/W) 1.4 1.2 1 0.8 0.6 0.4 0.2 0 1 4 8 12 16 RthSA 100% load continuous 10-60 Hz Power 150% RthSA 150% load (1 min.) 10-60 Hz Power 100% RthSA 150% load (1 min.) down to 3 Hz 1.0 hp (0.75 kW) 60 50 40 30 20 10 0 20 24 PWM Frequency (kHz) - (Induction Motor Load) Figure 4a. 1hp/4.4A Output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency 2.5 70 Thermal Resistance (RthSAC/W) 2 RthSA 100% load continuous 10-60 Hz 1.5 50 40 Power 150% 1 RthSA 150% load (1 min.) 10-60 Hz RthSA 150% load (1 min.) Down to 3 Hz 30 0.5 Power 100% 20 0.75 hp (0.56 kW) 10 0 1 4 8 12 16 20 24 0 PWM Frequency (kHz) - (Induction Motor Load) Figure 4b. 0.75hp/3.5A output Heat Sink Thermal Resistance and Power Dissipation vs. PWM Frequency NOTE: For Figures 4a and 4b: Operating Conditions: Vin = 230Vrms, MI = 1.15, PF = 0.8, TA = 40C, ZthSA limits T c rise during 1 minute overload to 10C page 4 Total Power Dissipation (Watts) 60 Total Power Dissipation (Watts) 1.6 IRPT1060A 1500 C, Capacitance (pF) 1200 VGE, Gate-to-Emitter Voltage (V) VGE = 0V, f = 1MHz C ies = C ge + C gc , C ce SHORTED C res = C gc C oes = C ce+ Cgc 20 VCC = 400V I C = 16A 16 C ies 900 12 600 8 C oes 300 4 C res 0 1 10 100 0 0 20 40 60 80 VCE , Collector-to-Emitter Voltage (V) Figure 5a. Typical Capacitance vs Collector-to-Emitter Voltage QG, Total Gate Charge (nC) Figure 5b. Typical Gate Charge vs Gate-to-Emitter Voltage 100 IC , Collector-to-Emitter Current (A) T J = 150 o C 10 1 T J = 25 C o VCC = 50V 5s PULSE WIDTH 0.1 5 10 15 Figure 6. Nominal R-T Characteristics of the NTC Thermistor VGE, Gate-to-Emitter Voltage (V) Figure 5c. Typical Transfer Characteristics page 5 IRPT1060A Mounting Procedure Mounting 1. Connect the driver board and the IRPT1060A power module. 2. Remove all particles and grit from the heat sink and power substrate. 3. Spread a .004" to .005" layer of silicone grease on the heat sink, covering the entire area that the power substrate will occupy. Recommended heat sink flatners is .001 inch/inch and Total Indicator Readout (TIR) of .003 inch below substrate. 4. Place the power substrate onto the heat sink with the mounting holes aligned and press it firmly into the silicone grease. 5. Place the 2 M4 mounting screws through the PCB and power module and into the heat sink and tighten the screws to 1 Nm torque. Functional Information Heat Sink Requirements Figures 4a-4b show the thermal resistance of the heat sink required for various output power levels and Pulse-WidthModulated (PWM) switching frequencies. Maximum total losses of the unit are also shown. This data is based on the following key operating conditions: * The maximum continuous combined losses of the rectifier and inverter occur at full pulse-width-modulation. These maximum losses set the maximum continuous operating temperature of the heat sink. * The maximum combined losses of the rectifier and inverter at full pulse-width-modulation under overload set the incremental temperature rise of the heat sink during overload. * The minimum output frequency at which full load current is to be delivered sets the peak IGBT junction temperature. * At low output frequency, IGBT junction temperature tends to follow the instantaneous fluctuations of the output current. Thus, peak junction temperature rise increases as output frequency decreases. Figure 7. Power Module Mounting Screw Sequence Power Connections The power module pin designation, function and other details can be obtained from the package outline Figure 8 and circuit diagram Figure 9. Three phase input connections are made to pins R, S and T and inverter output connections made to pins U, V and W. Positive rectifier output and positive inverter bus are brought out to pins RP and P respectively in order to provide DC bus capacitor soft charging implementation option. The current shunt terminals are connected to pins IS1, IS2 and IS3, IS4 on the positive and negative DC rails respectively. page 6 098765432109876543210987654321 098765432109876543210987654321 09876543210987654321098765432 098765432109876543210987654321 098765432109876543210987654321 098765432109876543210987654321 098765432109876543210987654321 098765432109876543210987654321 098765432109876543210987654321 098765432109876543210987654321 098765432109876543210987654321 098765432109876543210987654321 1 098765432109876543210987654321 1 2 Over-Temperature Protection Over-temperature can be detected using the NTC thermistor included in the power module for thermal sensing. Protection circuit that initiates a shutdown if the temperature of the IMS substrate exceeds a set level can be implemented. The nominal resistance vs. temperature characteristic of the thermistor is given in Figure 6. Voltage Rise During Braking The motor will feed energy back to the DC link during regenerative braking, forcing the bus voltage to rise above the level defined by the input line voltage. Deceleration of the motor must be controlled by appropriate PWM control to keep the DC bus voltage within the rated maximum value. IRPT1060A IRPT1060A Mechanical Specifications NOTE: Dimensions are in inches (millimeters) Figure 8a. Package Outline and Mechanical Specifications page 7 IRPT1060A IRPT1060A Mechanical Specifications NOTE: Dimensions are in inches (millimeters) ALL PIN COORDINATE DIMENSIONS ARE BASIC .750 [19.05] .450 [11.43] .550 [13.97] .550 [13.97] .450 [11.43] .750 [19.05] .950 [24.13] W .150 [3.81] .050 [1.27] .150 [3.81] .250 [6.35] 1.050 [26.67] .875 [22.27] PIN CENTER RT1 RT2 N/C RP P IS1 IS2 E1 G1 E3 G3 U V E5 G5 N .000 [0.00] N/C T PIN CENTER .875 .[22.27] E4 G4 E6 G6 N/C IS4 IS3 E2 G2 S R .350 [8.89] .250 [6.35] .000 [0.00] .850 [21.59] .650 [16.51] .050 [1.27] .650 [16.51] .850 [21.59] 1.050 [26.67] PIN DIAGONAL .037 - .034 [.940 - .864] 28X .010 M A 28X [ .026 - .024)] 28X .040 [1.02] MOUNTING SURFACE IN CLAMPED CONDITION -A- Figure 8b. Package Outline and Mechanical Specifications page 8 IRPT1060A Figure 9. Power Module Circuit Diagram page 9 IRPT1060A Figure 10. Recommended Gate Drive Circuit page 10 IRPT1060A Part Number Identification and Ordering Instructions IRPT1060A Power Module Chip and wire epoxy encapsulated module with 800V rectifiers, 600V short-circuit rated, ultra-fast IGBT inverter with ultra-fast freewheeling diodes, temperature sensing NTC thermistor and current-sensing low-inductance shunts. IRPT1060D Driver-Plus Board Printed circuit board assembled with DC link capacitors. NTC in-rush limiting thermistors, high-power terminal blocks, surge suppression MOVs, IGBT gate drivers, protection circuitry and low power supply. The PCB is functionally tested with standard power module to meet all system specifications. IRPT1060C Integrated Power Module (IRPT1060A) and Driver-Plus Board (IRPT1060D) pre-assembled and tested to meet all system specifications. IRPT1060E Design Kit Complete (IRPT1060C) with full set of design documentation including schematic diagram, bill of material, mechanical layout of Driver Board, schematic files, Gerber files and design tips. page 11 IRPT1060A WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: 171 (K&H Bldg.), 3-30-4 Nishi-ikebukuro 3-Chome, Toshima-ku, Tokyo Japan Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 8/97 page 12 |
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